With the development of science and technology, many electronic products are developing in the direction of miniaturization and refinement, which makes the size of many SMD components smaller and smaller. Not only the requirements for the processing environment are constantly improving, but also higher requirements for SMT processing technology. To do a good job in PCBA processing and SMT patch work, the processing factory needs to do at least the following three points.

Three requirements for good PCBA processing

1. In the SMT process, everyone knows that solder paste is needed. For newly purchased solder paste, if not used immediately, it must be stored in an environment of 5-10 degrees. In order not to affect the use of solder paste, it should not be placed in a sub-zero environment.

Second, in the SMT process, the placement machine equipment must be checked frequently. If the device is old or some parts are damaged, it must be repaired or replaced with a new device to ensure that the patch is not bent. In this way, the production cost can be reduced and the production efficiency can be improved.

3. In the process of SMT processing, in order to ensure the quality of PCB board welding, we must always pay attention to whether the setting of reflow soldering process parameters is very reasonable. If there is a problem with the parameter settings, the quality of the PCB board soldering cannot be guaranteed. So in general, the furnace temperature must be checked twice a day, at least once. Constantly improving the temperature curve and setting the temperature curve of the welded product can ensure the quality of the processed product.